Unique 3D Processors

Hardware

Sunday, 05 July 2009 20:29 Written by Administrator

The advancements in the Processor industry has been very high. There is almost one more new processor coming up every fortnight!! We have Dual core, Core 2 Duo, the Quad core. These are new layers that are added to make a faster processor. But the problem with this technology of integrated circuits is that, after a certain limit, it is really not possible to squeeze in more chips as layers. This infact shows to say that this technology can no more be used. So what is the alternative???

Scientists at Rochesterb University have developed processors based on 3D Circuits! This for sure is the next technology to be used in developing faster and compact processors! This processor was optimises the processing functions vertically, through multiple layers of processors.
Hence tasks like Synchronicity, Power Distribution, and Long-Distance Signaling are all fully functioning in three dimensions for the first time!! The 3-D Chip is essentially an entire circuit board folded up into a tiny package. Unlike past 3D chips that were simply stacks of regular processors, this new chip, has its layers flush against one another, with millions of tiny holes drilled through the layers to connect them, giving the 3D chip abilities unachievable by single layer processors. One major obstacle in making a 3D chip is the heat that it liberates. Ordinary cooling methods such as the CPU fan do not go well with 3D chip and there might be future mechanisms where water is allowed to flow between the layers, providing for a scalable cooling solution!! Interconnects between the layers would be insulated, protecting them from the water and allowing for the layers to still communicate at high-speeds.

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